Cognex solutions support wafer and semiconductor device manufacturing processes
The visual code reader is not only simple and easy to use, but also costs the same as a laser scanner
Cognex machine vision solutions are critical to every step of the semiconductor device manufacturing process, from wafer manufacturing to integrated circuit (IC) packaging and installation. Cognex tools can handle a variety of integrated circuit (IC) package types, including lead components, system-on-chip (SoC), and micro-electromechanical system (MEMS) devices, etc., providing tracking capabilities throughout the assembly process. Vision tools can find the characteristics of wafers, dies and packages under extremely harsh conditions, and can detect low-contrast and disturbing images, changing reference patterns, and other component changes.
Cognex supports a wide range of applications in wafer and semiconductor device manufacturing processes, including:
- Wafer, die and probe calibration
- measure
- Coating quality inspection
- Identification and tracking capabilities
Machine vision performs calibration, inspection, and identification to help manufacture high-quality wafers for integrated circuits (ICs) and other semiconductor devices. Machine vision can perform wafer processing on its own to achieve accurate calibration, inspect solder pads and probes, and measure important dimensions of the crystalline silicon architecture. Wafer processing, inspection and identification
Grain quality: cutting guidance, inspection, classification and joining
After the wafer processing is completed, the die will be separated from their wafers and classified according to various qualities. The vision system will guide the cutting machine, and the vision tool will find the cracks and fragments that affect the quality of the grain. The inspection will confirm the resistance mark and evaluate the LED color quality and brightness. After the die is successfully sorted, it will then be bonded to its package.
Semiconductor manufacturing: mounting and packaging
Wafer mounting is a link in the semiconductor manufacturing process, during which the wafers are prepared for packaging. Cognex tools can handle a variety of packaging categories, from boot components to the latest SoC and MEMS devices. Cognex wire bonder kits provide pin and pad positioning, as well as tools for inspection after joining.
Wafer to package tracking capability
Even if the logo on the back of the die, substrate, colloidal package and PCB have deteriorated, reflective or low contrast, industrial image readers can read it, improving the complete tracking ability. In-Sight 1740 series wafer readers can reliably track tool components from processing to assembly by reading barcodes on PCB and IC packages, maximizing tool utilization and productivity.
Ingot solidification
Cognex machine vision products can monitor the solidification of the ingot and provide dimensional measurement during the crystal pulling process. In-Sight 8000 is a small and powerful edge detection tool that can ensure that the execution of seed crystal, shoulder laying, shoulder circuit and diameter equalization stage meets the strict standards for the correct solidification of the ingot.
