Printed Circuit Board (PCB) is a basic component of various electronic products. It is a mechanical component formed by insulating materials and conductor wiring. It is mainly used to carry electronic components, and the electronic circuits formed by the circuit board are used to connect the various electronic components together as a bridge for communication between circuits. It is widely used in aerospace military, precision instruments, computers, communications, consumer electronics and various industrial products.
If distinguished by product portfolio, printed circuit boards can be divided into single-layer boards, double-layer boards and multilayer boards, and flexible boards (FPC) and IC carrier boards. Among them, single-layer boards are mainly used in low-end consumer electronic products, such as computers, radios, traditional TVs, refrigerators, etc.; while double-layer boards are used in electronic devices with more complex circuits, such as smart air conditioners, telephones, and faxes. As for complex high-end electronic products, because the circuit of the product is complex and the quality requirements for electronic signals are quite high, the use of multilayer boards can reduce the difficulty of circuit design and the influence caused by mutual interference of electronic signals. At the current stage, Taiwan’s circuit board product structure is differentiated by layer, and mainly four, six, and eight-layer multilayer boards for PCs and notebooks. According to the data of TPCA (Taiwan Printed Circuit Association) As of 2003, multilayer boards still accounted for 63.6% of the proportion of my country’s PCB product output value. In addition, since packaging technology is an important part of the electronics industry, current IC substrates are developing towards the three major mainstreams of BGA, CSP, and Flip Chip (BGA, CSP, and Flip Chip are three different packages of IC). Among them, Flip Chip is also Because it has better heat dissipation and can be combined with many mainstream products such as BGA and CSP at the same time, it is expected to become a leading indicator of carrier board technology. However, the flexible board industry has seen significant growth due to the wide application of downstream products, plus its advantages of good flexibility, light weight, thin thickness, three-dimensional wiring and less space constraints. According to TPCA data, the output value of Taiwan's soft boards and IC substrates in 2003 increased by 34% and 43% respectively compared with 2002. In the future, with the development trend of light, thin, short and diversified electronic products, the proportion of single and double panels will gradually decline. The application of high-end boards such as multi-layer boards, flexible boards, IC carrier boards and HDI will be more extensive.
source:
http://www.entrust.com.tw/eim/quarter/eim_quarter_4_32_34.htm
If distinguished by product portfolio, printed circuit boards can be divided into single-layer boards, double-layer boards and multilayer boards, and flexible boards (FPC) and IC carrier boards. Among them, single-layer boards are mainly used in low-end consumer electronic products, such as computers, radios, traditional TVs, refrigerators, etc.; while double-layer boards are used in electronic devices with more complex circuits, such as smart air conditioners, telephones, and faxes. As for complex high-end electronic products, because the circuit of the product is complex and the quality requirements for electronic signals are quite high, the use of multilayer boards can reduce the difficulty of circuit design and the influence caused by mutual interference of electronic signals. At the current stage, Taiwan’s circuit board product structure is differentiated by layer, and mainly four, six, and eight-layer multilayer boards for PCs and notebooks. According to the data of TPCA (Taiwan Printed Circuit Association) As of 2003, multilayer boards still accounted for 63.6% of the proportion of my country’s PCB product output value. In addition, since packaging technology is an important part of the electronics industry, current IC substrates are developing towards the three major mainstreams of BGA, CSP, and Flip Chip (BGA, CSP, and Flip Chip are three different packages of IC). Among them, Flip Chip is also Because it has better heat dissipation and can be combined with many mainstream products such as BGA and CSP at the same time, it is expected to become a leading indicator of carrier board technology. However, the flexible board industry has seen significant growth due to the wide application of downstream products, plus its advantages of good flexibility, light weight, thin thickness, three-dimensional wiring and less space constraints. According to TPCA data, the output value of Taiwan's soft boards and IC substrates in 2003 increased by 34% and 43% respectively compared with 2002. In the future, with the development trend of light, thin, short and diversified electronic products, the proportion of single and double panels will gradually decline. The application of high-end boards such as multi-layer boards, flexible boards, IC carrier boards and HDI will be more extensive.
source:
http://www.entrust.com.tw/eim/quarter/eim_quarter_4_32_34.htm
